Prototype PCB Assembly of Communication Equipment

Prototype PCB Assembly of Communication Equipment

Name: Prototype PCB Assembly of Communication Equipment
SMT Lines: 7 high-speed SMT patch production lines
Daily SMT Capacity: Over 30 million points
Inspection Equipment: X-RAY inspection machine, first piece tester, AOI automatic optical inspection machine, ICT tester, BGA rework station
Mounting Speed: Chip component mounting speed (optimal state) 0.036 S/piece
Smallest Pitch Capability: 0201, with an accuracy of ±0.04mm
Minimum Device Precision: Capable of mounting devices such as PQCC, QFP, BGA, CSP, etc., with pin pitches up to ±0.04mm
IC Mounting Precision: High level of precision in mounting ultra-thin PCBs, flexible PCBs, and gold fingers. Capable of mounting/inserting/mixed assembly TFT display driver boards, mobile phone motherboards, battery protection circuits, and other challenging products.

Product Details

There are more than 50 SMT production lines, equipped with new imported Fuji NXTIII, AIMEX, XPF automatic solder paste printing machine, 12-temperature lead-free nitrogen reflow oven, wave soldering and other high-end equipment. It is also equipped with on-line 3D AOI, 3D SPI, 3D X-RAY, intelligent first piece tester, automatic board separator, crimping machine, BGA rework station, ICT, three-proof paint and other equipment, focusing on R&D sampling, batch SMT placement, assembly and other services.

SMT Soldering equipment