8-layer communication PCBPCBA design

Name: 8-layer communication PCB/PCBA design

 

Sheet: IT180, F4BM, FR4, FR1-4, etc.

 

Designable layers: 1-32 layers

 

Minimum line width and line spacing: 3mil

 

Minimum laser aperture: 4mil

 

Minimum mechanical aperture: 8mil

 

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

 

Peel strength: 1.25N/mm

 

Minimum punching hole diameter: single side: 0.9mm/35mil

 

Minimum hole diameter: 0.25mm/10mil

 

Product Details

 

Aperture tolerance: ≤φ0.8mm±0.05mm

Communications PCBs are also used in general telecommunications systems such as cell towers, satellites, high-speed routers and servers, and commercial telephony. Telecom PCBs are also frequently used to control LED displays and indicators.

 

 

 

The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second layer of solder resist ink layer, the substrate includes a high-frequency area and an auxiliary area, the auxiliary area is finally fixed, and the inlay in the high-frequency area should be located at a fixed position. The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. Provide mechanical support. The utility model discloses that the high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized and the production cost is reduced.