10-layer 3+N+3 HDI PCB 3

10-layer 3+N+3 HDI PCB

Name: 10-layer 3-stage HDI PCB

Layers: 3+N+3

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 126*118mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.25mm

Line width and spacing: 2.8/3.2mil

Product Details

Technical Features and Applications of HDI PCBs

Impedance Specifications

· 50 Ω Antenna

· 90Ω & 100Ω Differential Impedance

Applications

Consumer Electronics

· Cell Phones

· Tablets

· Ultrabooks

· E-Readers

· MP3 Players

· GPS

· Portable Game Consoles

· DSCs (Digital Still Cameras)

· Cameras

· LCD TVs

· POS Terminals

High-Density Interconnect (HDI) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

· Mobile Phones

· Touch Screen Devices

· Laptops

· Digital Cameras

· 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

· Medical Equipment

· Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.