Extruded Aluminum Circuit Board Heat Sink PCB Heatsink1

3 year ago

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Suzhou Remgar Metal Manufacturer Co.,Ltd.

3 year

Product details

BGA heat sink is a type of aluminum heat sink designed to mounted to BGA devices. BGA heat sinks are used to dissipate heat generated by the BGA ICs during operation, preventing them from overheating and causing damage to the circuit.The BGA heat sink is typically made of a thermally conductive material such as aluminum or copper, which helps to transfer heat away from the BGA ICs.Actually BGA heat sinks are just simple aluminum extrusions. BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications. The number and size of the crosscuts are dependent upon the environment. Because BGA heat sinks are generally small, the attachment of the aluminum heat sink is a challenge. The heat sinks can be either attached to the device or to the PCB depending upon the application and the mechanical requirement.The heat sink is attached directly to the BGA package using thermal adhesive or other attachment methods.BGA heat sinks come in a variety of shapes and sizes, depending on the specific requirements of the BGA ICs being used. Some BGA heat sinks are designed to be attached directly to the BGA package, while others are designed to be mounted on a PCB or other surface.In addition to dissipating heat, BGA heat sinks can also help to improve the overall performance and reliability of BGA ICs. By keeping the temperature of the ICs within a safe operating range, BGA heat sinks can help to prevent thermal throttling and other performance issues.Overall, BGA heat sinks are an essential component in many modern electronic devices, helping to ensure the reliable and efficient operation of BGA ICs in a wide range of applications.

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Suzhou Remgar Metal Manufacturer Co.,Ltd.

Audited supplier

3 year

Main Product: Heatsink, Cnc Precision Machining , Extrusion Mould, Aluminum Heat sink, Aluminum Profile, Aluminum Extrusion

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