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3-Ceramic Substrate

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Polished ZrO2 Plate Sheet Wafer Zirconia Ceramic Substrate


Introduction of Zirconia Ceramic Substrates

Zirconia ceramics have high toughness, high flexural strength, high wear resistance, excellent thermal insulation properties and the thermal expansion coefficient close to that of steel. Zirconia ceramic substrates have obvious advantages, such as strong mechanical properties, high temperature resistance, corrosion resistance, low thermal conductivity, and high insulation. There are irreplaceable applications.


Why Polished?

Before the ceramic substrate is metallized, most of the surface of the ceramic substrate needs to be lapped and polished, and there are two ways: single-sided and double-sided. The main purpose is to remove the attachments on the surface, improve the flatness, and obtain a thinner metallization layer. Therefore, lapping and polishing are very important for ceramic substrates, which will directly affect the effect of ceramic metallization.


Material Properties of Zirconia Ceramic Substrates

Zirconia Ceramic Substrate

Item

Unit

ZrO2

Mechanical Properties

Color

/

White

Density

g/cm3

6

Water Absorption

%

0

Vickers Hardness (Load 4.9N)

Gpa

11

Young’s Modulus

GPa

200

Flexural Strength

Mpa

>800

Fracture Toughness

MPa·m1/2

5.0

Thermal Properties

Max. Service Temperature (Non-loading)

ºC

1000

CTE (Coefficient of Thermal Expansion) (20-800℃)

1×10-6/℃

7.8

Thermal Shock Resistance

10 Times

No Crack

Thermal Conductivity (25ºC)

W/m·K

>3

Specific Heat (25ºC)

J/kg·K

460

Electrical Properties

Volume Resistivity (25ºC)

Ω·cm

1013

Dielectric Strength

KV/mm

10

Dielectric Constant (25℃, 1MHz )

(E)

33

Dielectric Loss Angle (25℃, 1MHz )

×10-4

16


Production Process of Zirconia Ceramic Substrates

The Process Flow of Bare Zirconia Substrate


Product Inspection

Inspection of Bare Ceramic Substrates_07



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