Insulating Electronic Ceramics
3 year ago
40-Pin Ceramic Quad Flat Package (CQFP) for Optical and RF Modules
Product Overview
The 40-Pin Ceramic Quad Flat Package (CQFP) is a high-density, surface-mount solution for complex integrated circuits and multi-chip modules. As a premier example of advanced Ceramic IC Packaging, the CQFP provides a hermetically sealed cavity to protect sensitive semiconductor devices while offering a high number of I/O connections in a compact footprint. The gull-wing leads provide compliant connections to the printed circuit board, absorbing thermal stress and ensuring a reliable solder joint. This package is ideal for mixed-signal, RF, and optical applications where performance, density, and reliability are paramount.
Technical Specifications
| Parameter | Specification |
|---|---|
| Pin Count | 40 |
| Lead Pitch | Options available (e.g., 0.8mm, 0.65mm, 0.5mm) |
| Body Material | Multilayer Alumina ($Al_2O_3$) Ceramic (Black or White) |
| Lead Frame Material | Kovar (Fe-Ni-Co Alloy) |
| Plating | Nickel (Ni) underplate with Gold (Au) finish |
| Hermeticity | Meets MIL-STD-883 standards |
| Sealing Method | Compatible with seam sealing or AuSn solder sealing |
| Chip Cavity Dimensions | Customizable to fit specific die sizes |
Product Images
Features & Advantages
- High I/O Density: Provides a large number of connections in a minimal board area, enabling system miniaturization.
- Excellent Electrical Performance: The ceramic construction and short lead lengths offer low parasitics, making the CQFP suitable for high-frequency applications.
- Superior Reliability: A true hermetic seal protects the IC from moisture, corrosion, and contaminants, making it ideal for aerospace, defense, and high-reliability industrial applications.
- Thermal Expansion Matching: The ceramic body's coefficient of thermal expansion (CTE) is well-matched to semiconductor materials like silicon and GaAs, reducing stress on the die.
- Surface Mount Design: Gull-wing leads are easily inspected and reworked, simplifying the PCB assembly process.
Application Scenarios
The versatility of the CQFP makes it a preferred choice for a wide range of demanding applications:
- Coherent optical transceivers and modules
- Wireless RF Packaging for transceivers and power amplifiers
- High-speed Analog-to-Digital (ADC) and Digital-to-Analog (DAC) converters
- Field-Programmable Gate Arrays (FPGAs) and ASICs
- Medical imaging and diagnostic equipment
Benefits for Customers
- Enable Complex Designs: The high pin count supports complex ICs with numerous power, ground, and signal lines.
- Increase Product Lifespan: The hermetic ceramic enclosure provides the ultimate protection for your valuable semiconductor die.
- Achieve Higher Performance: The excellent electrical and thermal properties of the package allow your IC to operate at its full potential.
- Flexible and Customizable: We can tailor the internal routing, cavity size, and lead configuration to create a bespoke packaging solution.
FAQ (Frequently Asked Questions)
Q1: What is the difference between a CQFP and a plastic QFP (PQFP)?
A1: The key differences are the body material and sealing. A CQFP uses a ceramic body and provides a true hermetic seal, making it suitable for high-reliability applications. A PQFP uses a plastic mold compound, is non-hermetic, and is generally used for commercial or consumer-grade products where cost is the primary driver.
Q2: Can a heat sink be attached to this package?
A2: Yes. We can design CQFP packages with an integrated metal heat slug in the base or a flat top surface suitable for attaching a top-side heat sink, depending on the thermal requirements of your application.
Q3: What information do you need to provide a quote for a custom CQFP?
A3: To provide an accurate quote, we typically require the die size, number of bond pads, a desired pinout diagram, the target lead pitch and body size, and any special thermal or electrical performance requirements.
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Tungsten Heavy Alloys,
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Rhenium Alloys,
Tantalum Alloys,
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