Picosecond laser cutting and splitting equipment-2
2 year ago
The Picosecond Laser Cutting And Splitting Machines serve the purpose of precise glass cutting and fragmentation. They boast features such as exceptional cutting precision, increased yield of final products, and heightened operational efficiency. With dual platforms moving simultaneously—one for picosecond processing and the other for CO2 fragmentation—they achieve a twofold increase in efficiency. Notably, their capabilities shine when cutting irregular-shaped glass, showcasing significant advantages in this specialized area.
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