Double-sided Metallized DBC Substrate
4 week ago
Product details
Double-sided Copper Clad Laminate DBC Substrate
Double-sided copper clad DBC substrates are high-performance substrates that are widely used in the area of electronic packaging.
They are made up of a ceramic substrate, which can be made from materials like alumina or aluminum nitride. This ceramic substrate serves as the middle insulating layer. Then, there's a layer of copper foil stuck to both the top and bottom surfaces of the ceramic substrate by a special bonding process.
This kind of structure brings together the great insulating properties, high mechanical strength, and thermal stability of ceramic materials with the good electrical conductivity and thermal conductivity of copper foil. In this way, it achieves a good combination of electrical insulation, efficient heat dissipation, and signal transmission.
Performance Characteristics
Excellent Thermal Management Capability: The ceramic substrate has a relatively high thermal conductivity, which can quickly conduct heat from the heating elements to the entire substrate. Moreover, the double-sided copper cladding further enhances the heat dissipation effect, effectively reducing the operating temperature of electronic components such as chips and improving their reliability and service life.
Good Electrical Insulation Performance: Ceramic materials themselves are excellent insulators, which can well achieve electrical isolation between different circuit layers, avoid problems such as short circuits and signal interference, and ensure the normal operation of electronic equipment.
High Mechanical Strength and Stability: The ceramic substrate endows the substrate with high hardness and mechanical strength, enabling it to withstand certain external impacts and vibrations. Meanwhile, it remains dimensionally stable under different working environments and is not prone to deformation and warpage.
Good Solderability and Conductivity: The surface of the copper foil has good solderability, facilitating welding connections with chips, electronic components, etc., and enabling low-resistance electrical connections to ensure efficient signal transmission.
Manufacturing Process
It usually includes steps such as the preparation of ceramic substrates, pretreatment of copper foil, bonding process, and subsequent processing. Among them, the bonding process is a key link. Currently, the commonly used method is the Direct Bonded Copper (DBC) technology, which bonds the copper foil and the ceramic substrate directly together under high temperature, high pressure, and a certain atmosphere protection to form a firm bonding interface.
Application Fields
Power Electronic Devices: For example, insulated gate bipolar transistors (IGBTs), power field-effect transistors (MOSFETs), etc. Double-sided copper-clad DBC substrates can effectively solve the heat dissipation problems of these devices when operating at high power and improve their performance and reliability.
High-Frequency Electronic Circuits: In high-frequency fields such as microwave communication and radar, their good electrical performance and signal transmission characteristics can ensure the low-loss transmission of high-frequency signals and reduce signal distortion and interference.
Optoelectronic Devices: They are used for the packaging of optoelectronic devices such as light-emitting diodes (LEDs) and laser diodes, providing good heat dissipation and electrical connections and improving the luminous efficiency and service life of optoelectronic devices.
Automotive Electronics: With the development of automotive electrification and intelligence, double-sided copper-clad DBC substrates have also been widely used in automotive power systems, autonomous driving systems, etc., meeting the requirements of automotive electronics for high reliability, high heat dissipation, and high integration.
Direct Bonded Copper DBC Metallization Substrate Performance Table
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Shaanxi Puwei Electronic Technology Co., Ltd
Audited supplier
4 month
Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics ,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
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