metallized ceramics

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Shaanxi Puwei Electronic Technology Co., Ltd

5 month

Product details

DPC Metallized Substrate For Thin Film Circuits

The DPC metallized ceramic substrates which are used in thin film circuits are usually made from aluminum nitride (AlN) or aluminum oxide (Al₂O₃). These ceramic substrates can give really good electrical insulation and can also conduct heat well. By using the direct copper plating (DPC) metallization method, a layer of copper film is put on the surface of the ceramic substrate. This copper film can form patterns that can conduct electricity precisely and evenly. The process of depositing copper is what makes sure that the thin film circuits can work properly.

The making of DPC metallized substrates for thin film circuits mainly has three steps.

First of all, get the ceramic substrate ready and clean it well to make sure its surface is smooth and there's no dirt on it.

Second, use techniques like sputtering or evaporation to put a thin layer called a seed layer on the substrate. This seed layer is like the foundation for the next step of putting copper on it. Then, do further electroplating to make a thicker copper layer that has the right thickness and can conduct electricity well.

Finally, use photolithography and etching techniques to make patterns on the copper layer so that it can form the specific circuit layout that the thin film circuits need.

DPC Substrate Available Ceramic Types And Properties

DPC Substrate Production and Preparation Process Flow

Applications

Integrated Circuits: In the manufacturing of integrated circuits, DPC Metallized Substrate For Thin Film Circuits is used to fabricate interconnects, pads, and other conductive structures. Its high precision and miniaturization capabilities allow for the realization of complex circuit designs with a large number of components in a small area.

Microelectromechanical Systems (MEMS): In MEMS devices, the substrate provides a stable platform for the integration of mechanical and electrical components. The excellent thermal and electrical properties of the substrate ensure the proper functioning of MEMS sensors and actuators.

Optoelectronic Devices: For optoelectronic devices such as light-emitting diodes (LEDs) and laser diodes, the substrate is used to fabricate the electrodes and interconnects. The good heat dissipation and electrical conductivity of the substrate help to improve the performance and reliability of these devices.

RF and Microwave Circuits: In RF and microwave circuits, the substrate's high electrical conductivity and low dielectric loss are crucial for achieving high-frequency performance. It is used to fabricate transmission lines, antennas, and other RF components with low signal attenuation and high efficiency.

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Shaanxi Puwei Electronic Technology Co., Ltd

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5 month

Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates , Metallized Ceramics, AlN Ceramics Disc, DPC Substrate, DBC Ceramic Substrate

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