Laser Drilling Alumina Ceramic Substrate Product Features
(I) Precision Drilling Process
Ultra-high Precision Control: Utilizing advanced laser micro-machining systems, the aperture tolerance can be precisely controlled within ±10μm, and even within ±5μm under specific fine process requirements, ensuring the consistency and accuracy of each drilled hole. Whether it's tiny holes for chip pin connections or complex internal interconnection micro-hole structures, they can all perfectly meet the design specifications.
Implementation of Complex Patterns: It supports the design of various drilling patterns, including dense micro-hole arrays and special-shaped hole layouts, easily meeting the precise positioning and electrical connection requirements between different layers in multi-layer circuit boards. For example, in the RF module substrates of 5G communication base stations, it can precisely drill meandering yet evenly spaced micro-hole channels for signal transmission, ensuring low-loss transmission of high-frequency signals.
(II) Superior Material Properties
Excellent Electrical Insulation: Alumina ceramic inherently has an extremely high resistivity, greater than 10¹⁴Ω·cm. This property remains intact after laser drilling, providing a reliable insulation barrier for electronic components and effectively preventing short circuits. Even under harsh environmental conditions such as high humidity and strong electric fields, it can still ensure the stable operation of electronic equipment. It is suitable for high-voltage power electronic devices like IGBT module substrates.
Efficient Heat Conduction: The thermal conductivity is usually between 15 - 30 W/(m·K). The laser drilling process skillfully avoids key areas that affect the heat conduction path, enabling heat to be quickly dissipated from the heating elements through the substrate, reducing the chip junction temperature and improving the overall heat dissipation efficiency. It performs excellently in products with urgent heat dissipation requirements such as LED lighting and CPU heat dissipation substrates.
Strong Mechanical Stability: It has excellent flexural strength, generally reaching 250 - 400 MPa. The structural integrity of the substrate after drilling is fully maintained, enabling it to withstand the mechanical stress, vibration, and shock during the production and assembly of electronic products, as well as temperature cycling changes during long-term use, ensuring long-term reliable circuit connections. It is widely used in the core control substrates of aerospace electronic equipment.
(III) Good Machining Compatibility
Compatibility with Multiple Metallization Processes: The surface of the alumina ceramic substrate after drilling can smoothly undergo thick-film and thin-film metallization processes. Whether using the traditional screen printing and sintering of metal pastes to form circuits or applying advanced coating techniques such as sputtering and electroless plating to build fine metal lines, it can ensure that the metal layer is firmly bonded to the ceramic substrate with low contact resistance, meeting different current-carrying and signal transmission requirements.
Adaptability to Automated Production Processes: The product has high dimensional accuracy and good consistency, facilitating quick and precise positioning and processing on automated SMT (Surface Mount Technology) production lines and high-precision PCB (Printed Circuit Board) assembly equipment, significantly improving the production efficiency of electronic products and reducing production costs, conforming to the rhythm of large-scale industrial production.
Application Areas Of Laser Drilling Alumina Ceramic Substrate
Electronic Chip Packaging: As the substrate for advanced packaging forms such as direct chip attach (DCA) and ball grid array (BGA) packaging, it provides stable electrical connections and efficient heat dissipation channels for chips and external circuits. It is widely used in the packaging of high-performance chips such as mobile phone processors and computer GPUs, facilitating the performance improvement and miniaturization of electronic products.
Power Electronic Devices: In power modules such as IGBTs (Insulated Gate Bipolar Transistors) and MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), it can withstand high-current and high-voltage working conditions. With its excellent insulation and heat dissipation properties, it ensures the stable operation of devices for a long time, promoting technological innovations in fields such as the power systems of new energy vehicles and industrial motor frequency conversion speed control.
Communication Equipment: The RF front-end modules and optical communication module substrates of 5G base stations adopt laser drilling alumina ceramic substrates to meet the requirements for line precision and low loss in high-frequency millimeter-wave signal transmission, ensuring the high-speed and accurate exchange of massive data and laying a solid hardware foundation for the construction of the global communication network.
Consumer Electronics: For consumer electronic products with compact internal space and high functional integration, such as smartwatches and virtual reality/augmented reality devices, its thin, lightweight, and high-performance characteristics are utilized to realize complex circuit layouts, optimize key indicators such as product battery life and running speed, and enhance the user experience.
