Alumina DBC substrates

4 week ago

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Shaanxi Puwei Electronic Technology Co., Ltd

5 month

Product details

Direct Bonded Copper DBC Metallization of AlN Substrate

Thermal Properties

AlN has an extremely high thermal conductivity, usually about 170-230 W/(m·K), which is much higher than that of alumina. This enables the DBC AlN substrate to effectively dissipate heat generated by high-power electronic devices, ensuring their stable operation at high temperatures. The coefficient of thermal expansion of AlN is also well-matched with some semiconductor materials, reducing thermal stress during temperature changes.

Electrical Properties

It has excellent electrical insulation properties with a high breakdown voltage and low dielectric loss. The dielectric constant of AlN is stable over a wide frequency range, making it suitable for high-frequency and high-speed electronic circuits, ensuring minimal signal distortion and attenuation during transmission.

Mechanical Properties

The AlN substrate has high mechanical strength and hardness, providing a stable support for electronic components. The bonding strength between the copper layer and the AlN ceramic is strong, ensuring the reliability of the circuit connection and preventing the copper layer from peeling off during use.

Chemical Stability

AlN is chemically stable and resistant to corrosion by most acids, alkalis, and salts. This property allows the DBC AlN substrate to maintain its performance in various harsh chemical environments, extending its service life.

Manufacturing Process

The manufacturing process of DBC AlN substrate mainly includes the preparation of AlN ceramic green sheets, copper foil pretreatment, direct bonding at high temperatures and pressures, and subsequent processing and testing. The process requires strict control of parameters to ensure the quality and performance of the substrate.

In summary, the DBC metallization of AlN substrate combines the advantages of AlN ceramic and copper, and has excellent thermal, electrical, mechanical and chemical stability properties, playing an important role in the field of high-power, high-frequency and high-reliability electronic packaging.

Direct Bonded Copper DBC Metallization Substrate Performance Table

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Shaanxi Puwei Electronic Technology Co., Ltd

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5 month

Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc , DPC Substrate, DBC Ceramic Substrate

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