Semitron MP370

Semitron® MP 370 Ceramic Filled Modified PEEK offers more choices in the design and manufacture of precision test sockets for the semiconductor manufacturing industry. Semitron® MP 370 shapes exhibit excellent moisture absorption and thermal resistance, while also maintaining outstanding strength and dimensional stability. As a result, this grade is often selected for test socket applications where precision machining is critical, and complex geometries are prevalent.Semitron® MP 370 uses modified PEEK as a base resin offering higher heat for improved ability to machine clean fine features and improved toughness to resist breakage in use when compared to ceramic filled PEEK materials. Semitron® MP370 uses extrusion to manufacture ultra low stress consistent plate as compared to typical injection molded ceramic filled materials. Extruded material provides far better dimensional stability during machining allowing for finer features while maintaining tighter tolerances.

Advantages of Semitron® MP 370 Ceramic Filled PEEK:

Very low moisture absorption

Finer, cleaner detail possible – excellent machinability

Very high level of precision possible – low internal stresses

Good value – ideal for specific application environments

Material Properties

Exceptional machinability

Low internal stresses and no "soft center" problems associated with injection molded blanks

Excellent strength and stiffness

Very low moisture absorption

Good thermal machinability

Available Geometries

Semitron® MP 370 stock shapes encompass a range of standard sizes in the following geometries: Plate

Plate

Applications:

IC test sockets for semiconductor manufacturing equipment

Structural parts in electronics and telecom equipment

Insulating blocks and fixtures in diagnostic equipment