The DBC substrate used in the power module

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Shaanxi Puwei Electronic Technology Co., Ltd

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Direct Bonded Copper DBC Metallization of Alumina Substrate

Direct Bonded Copper (DBC) Metallization of Alumina Substrate is a widely used technology in the field of electronic packaging. The following is a key introduction to its performance parameters:

Direct Bonded Copper of Alumina Substrate

Thermal Properties

Thermal Conductivity: It typically has a thermal conductivity of around 24W/(m·K). Although it is lower than some ceramic materials like aluminum nitride, it can still meet the heat dissipation requirements of conventional power devices to a certain extent.

Coefficient of Thermal Expansion: Its coefficient of thermal expansion is about 7.1ppm/K, which is relatively close to that of silicon chips. This similarity helps reduce the thermal stress between the chip and the substrate caused by temperature changes, preventing chip damage and improving the reliability and stability of the packaging.

Heat Resistance: It has a wide operating temperature range, generally from -55°C to 850°C, enabling it to adapt to various working environments.

Electrical Properties

Insulation Resistance and Dielectric Withstand Voltage: It possesses excellent insulation properties with high insulation resistance and a dielectric withstand voltage usually greater than 2.5kV. This effectively isolates the chip from the heat dissipation base of the module, ensuring the electrical safety of the equipment.

Dielectric Constant: It has a relatively low dielectric constant and stable performance under high temperature and high humidity conditions, ensuring the reliability of electrical performance in different working environments.

Dielectric Loss: The dielectric loss is small, which can reduce the loss and distortion of signal transmission in high-frequency circuits.

Mechanical Properties

Mechanical Strength: It has sufficient mechanical strength. Besides serving as the bearing component of the chip, it can also withstand external mechanical stress and impact to a certain extent, showing good stability and durability. Its surface is smooth without warpage, bending, or microcracks, meeting the requirements of high-precision electronic packaging.

Bonding Strength: The bonding force between the copper foil and the alumina ceramic is strong, and the peel strength is usually ≥5.0 N/mm (50mm/min). This ensures that the copper foil does not easily fall off during use, thus ensuring the integrity and stability of the circuit.

Other Properties

Chemical Stability: It has good chemical stability and is not easily corroded by chemical substances such as acids, alkalis, and salts. It can maintain stable performance in harsh chemical environments.

Solderability: The copper foil on the surface has good solderability and is easy to be welded to chips, electronic components, etc. The welding wettability is ≥95 (Sn/0.7Cu), ensuring the welding quality and the reliability of the connection.

Moisture Resistance: It has no hygroscopicity and will not affect its performance due to absorbing moisture in the air, enabling it to work normally in humid environments.

Environmental Friendliness: The materials used are harmless and non-toxic, meeting environmental protection requirements and causing no harm to the environment and human health.

Direct Bonded Copper DBC Metallization Substrate Performance Table

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Shaanxi Puwei Electronic Technology Co., Ltd

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Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates , Metallized Ceramics, AlN Ceramics Disc, DPC Substrate, DBC Ceramic Substrate

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