Silicon Nitride AMB Substrate for Silicon Carbide Modules

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Shaanxi Puwei Electronic Technology Co., Ltd

4 month

Product details

Si3N4 AMB Copper-clad Substrate For SiC Modules

The silicon nitride ceramics that are chosen for the Si3N4-AMB substrate have a coefficient of thermal expansion that's pretty similar to that of SiC. They can handle the application environments that need high pressure, high temperature, and high frequency, which are exactly what SiC requires. It's suitable for SiC power modules that have different structures like HPD (High Power Density), DCM (Dual-Channel Memory), and T-PAK.

The Si3N4-AMB substrate makes use of silicon nitride ceramic materials. When you compare it with the aluminum oxide DBC substrate, it clearly has better qualities in things like thermal conductivity, the ability to resist heat and cold shocks, and toughness strength.

The way that AMB substrates are made is an improvement on the traditional process used for DBC substrates. Compared to DBC substrates, AMB substrates have big advantages in properties such as how much current they can carry and their bonding strength.

Silicon Nitride AMB Copper-clad Substrate Properties

EV are the largest terminal market for AMB ceramic substrates. To address the range anxiety of new energy vehicles, the penetration rate of the 800V high-voltage architecture is gradually increasing, and the "SiC + AMB" technological route has become an industry development trend. As the cost-performance ratio of SiC continues to improve, the prospects for large-scale application of SiC across industries are even more promising.

As the preferred packaging process, the Si₃N4-AMB substrate will be widely used in fields such as automotive electric drive, rail transit inversion, wind-solar-storage, and hydrogen energy.

We offer a variety of advanced ceramics, including alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, and ceramic metallization materials, to improve and expand the performance of your products, processes, or systems. Whether you need high temperature stability, high hardness and wear-resistant surface, increased stiffness to resist weight radiation, anti-corrosion barrier or low thermal expansion rate, we can provide them. We can provide significant performance and cost advantages to meet your needs.

Welcome to contact us for more information.

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Shaanxi Puwei Electronic Technology Co., Ltd

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4 month

Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc, DPC Substrate , DBC Ceramic Substrate

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