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Large-sized Silicon Nitride AMB Substrate

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Silicon Nitride Ceramic AMB Copper-clad Substrate

The product is based on silicon nitride ceramic substrate (Si3N4) and produced using active metal brazing (AMB) process. It is suitable for high power density, high reliability, and long service life applications such as silicon carbide (SiC) power modules.
 
AMB Silicon Nitride Ceramic Substrate
 
 

Product characteristics of silicon nitride AMB copper-clad substrate

●Excellent thermal conductivity and temperature resistance
●The coefficient of thermal expansion is similar to that of SiC
● High insulation and voltage resistance
● High reliability, high bending strength
● Can weld thicker copper layers
 
Silicon Nitride Ceramic AMB Copper-clad Substrate
 

Silicon Nitride AMB Copper-clad Substrate Properties

 
Silicon Nitride AMB Copper-clad Substrate Pro
 
 
 
We offer a variety of advanced ceramics, including alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, and ceramic metallization materials, to improve and expand the performance of your products, processes, or systems. Whether you need high temperature stability, high hardness and wear-resistant surface, increased stiffness to resist weight radiation, anti-corrosion barrier or low thermal expansion rate, we can provide them. We can provide significant performance and cost advantages to meet your needs.
 
Welcome to contact us for more information. 
 
 
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