Direct Bonded Copper DBC Metallization of Alumina Substrate

Introduction of Direct Bonded Copper Technology

Direct Bonded Copper (DBC) technology is a ceramic metallization method of bonding copper foil on the ceramic surface. The basic principle is to introduce oxygen element between Cu and ceramic, form Cu/O eutectic liquid phase at 1065-1083°C, and then react with ceramic substrate and copper foil to form CuAlO2 or Cu(AlO2)2, and realize the bonding between copper foil and substrate under the action of mesophase. 

What ceramic materials are used in DBC substrates

The ceramic materials used in DBC substrates mainly include alumina ceramic (Al2O3) and aluminum nitride ceramic (AlN), among which alumina ceramic is technically more mature than aluminum nitride ceramic, and has an advantage in price, so 80% of DBC substrates on the market use alumina. Alumina has good insulation, good chemical stability, high strength, and low price. It is the preferred material for DBC technology.

Is it good to use DBC substrates

The following is a comparison table of DBC process and other ceramic metallization processes.

Compared with other ceramic metallization processes, DBC process has the following advantages:
1. Strong current-carrying capacity.

2. Good heat resistance and reliable performance.                        

3. Precise alignment, and no difference in sintering shrinkage.

Product Quality

In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.